Hybrid Sources, Inc.
(772) 563-9100
2950 43rd Ave.
Vero Beach, Florida,
USA
32960
hybrid microciruit design and fabrication since 1985
Products & Services
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- Thick Film
- Thickfilm
- Hybrid Sources
- Hybrid Sources Inc
- Alumina Substrate
- Ceramic Substrate
- Thick Film Hybrid
- Hybrid Assembly
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- Screen Printing
- Micro Miniature
- Surface Mount
- Surfacemount
- Surface Mounting
- Smd
- Micro Electronics
- Microelectronics
Web Result
- HYBRID SOURCES, INC. Glossary
- A B C D E F G H IJK L M N O P QR S T UV W XYZ Nominal Resistance ValueThe specified resistance value of the resistor at its rated load. Nonconductive EpoxyAn epoxy material (polymer resin) either without a filler or with a ceramic powder filler added for increasing thermal conductivity and improving thixotropic properties. Nonconductive epoxy adhesives are used in chip to substrate bonds where ele...
- HYBRID SOURCES, INC. Glossary
- A B C D E F G H IJK L M N O P QR S T UV W XYZ Wedge BondA bond made with a wedge tool. The term is usually used to differentiate thermo-compression wedge bonds from other thermo-compression bonds (almost all ultrasonic bonds are wedge bonds). Wire BondIncludes all the constituent compounds of a wire electrical connection such as between the terminal and the semiconductor die. These components are:...
- HYBRID SOURCES, INC. Glossary
- A B C D E F G H IJK L M N O P QR S T UV W XYZ DefinitionThe sharpness of a screen-printed pattern - the exactness with which a pattern is printed. DielectricMaterials that do not conduct electricity and that are used for making capacitors, for insulating conductors (as in crossover and multi-layered circuits), and for encapsulating circuits. Dielectric ConstantThe term used to describe a material'...
- Contact HYBRID SOURCES, INC.
- Contact Us 2950 43rd AvenueVero Beach, FL 32960 Voice: (772) 563-9100Fax: (772) 563-9200 Email thickfilm@hybridsources.com HomeAbout HSIDesignThick Film AssemblyQualityGetting Started GlossaryContact Us ...
- HYBRID SOURCES, INC. Glossary
- A B C D E F G H IJK L M N O P QR S T UV W XYZ HeaderThe base of a hybrid circuit package that holds the leads. Heat SinkThe supporting member to which electronic components or their substrate or their package bottom are attached. This is usually a heat conductive metal with the ability to rapidly transmit heat from the generating source (component). HermeticSealed up so that it is gas tight. The t...
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