ait provides thin film fabrication services: deposition, sputtering, evaporation, photolithography. back end wafer processing: dicing, ion milling, micro-machining & assembly. biotechnology in mems and nanotechnology applications.

Products & Services

• • Mems
  • Sputtering
  • Evaporation
  • Pvd
  • Photolith
  • Cutting
  • Micro-machining
  • Wafer Dicing
  • Cutting
  • Lapping
• • Grinding
  • Polishing
  • Slicing
  • Honeycomb Cutting
  • Annealing
  • Cable Assembly
  • Glass Bonding
  • Epoxy Bonding
  • Precision Surface Grinding

Web Result

Advanced International Technology

From design to physical device, Advanced International Technology provides thin film deposition, back-end wafer processing, micro assembly and fabrication services. Prototyping and small to medium builds are our specialty. Wafer Dicing Wire Bonding - NEW!!! Ambient Temperature Wirebonding Assembly Machining / Tooling Precision Material Cutting Micro Machining High Precision Surface Grinding Precis...

http://www.aitechnology-usa.com/index.php?view=article&catid=5%3Acorporate&id=1%3Aadvanced-international-technology&tmpl=component&print=1&layout=default&page=

Advanced International Technology

Advanced International Technology - Advanced International Technology HomeProductsMagnetic HeadsSolar ArraysServicesWafer DicingThin Film ServicesWire BondingContacts In order to view this page you need Flash Player 9+ support!Get Adobe Flash player Home Advanced International Technology From design to physical device, Advanced International Technology provides thin film deposition, back-end wafer...

http://www.aitechnology-usa.com/

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