Advanced Packaging Technology
(619) 710-8170
7580 Britannia Ct., Ste. B
San Diego, California,
USA
92154
- Year Established:
- 1993
Products & Services
-
- Apta
- Advanced Packaging
- Memory Modules
- Custom Memory
- Mcm
- High Density Interconnect Substrate
- Microvias
- Buried Passives
- Bga
-
- Csp
- Cob
- Flip Chip
- Hybrid Circuit
- Microelectronics
- Hybrid Microelectronics
- Power Hybrid
- Thick Film Hybrid
- Ceramic Hybrid
Web Result
- APTA
- Skip Intro Welcome to APTA Group, Inc. We are the leading integrated provider of ultra high performance advanced packaging solutions, specializing in Microminiature Electronic Packaging (MEPSM). Our MEPSM Approach includes advanced features like high density substrates with micro vias, low K dielectric, integrated passives and thermal management, direct IC attach, all in ultra dense pin out format...
- APTA
- Applications Aerospace | Automotive | Industrial | Medical | Military | Telecom | Test and Measurement Industry Segment: Aerospace Part Description: Serial Interface Module 1.2 Gbit DRAM Module Parent Product Boeing 777 Flight Computer Spacecraft based Solid State Recorder Electrical Design: Customer Customer Layout: APTA APTA Circuit Size(X-Y) (inches) 1.20x0.39 2.635x1.680 Circuit Area (Sq. Inch...
- More information on LTTT
- MCM-C Ceramic Multichip Modules Table of Contents Materials Description Step Discussion Comparison of Process Steps Conductor Performance Design Specifications Transmission Lines 75 Micron Wide Transmission Line Stripline Using Fine Grind Gold and K=4.1 Transfer Tape Stripline Microstrip Buried 1K ohm Resistors Capacitors MCM Technology Comparison MCM Technology Comparison pg. 2 Thermal Coefficien...
- APTA
- Design Guidelines This information is also available in Adobe Acrobat format. Design.pdf (973k) INTRODUCTION: Intent and Scope: To establish working parameters and design standards for the optimal layout of circuits for fabrication and assembly at APTA Group, Inc. Definitions: Aspect ratio: Concerning resistor design, the length of the resistor divided by the width of the resistor (L / W), the len...
- Skip Intro
- Welcome to APTA Group, Inc. We are the leading integrated provider of ultra high performance advanced packaging solutions, specializing in Microminiature Electronic Packaging (MEPSM). Our MEPSM Approach includes advanced features like high density substrates with micro vias, low K dielectric, integrated passives and thermal management, direct IC attach, all in ultra dense pin out formats, includin...
Website Links:
Advanced Packaging Technology | 75 Micron Wide Transmission... | Application Example | Buried 1K ohm Resistors | Capacitors | Comparison of Process Steps | Conductor Performance | Customer Dissatisfaction Log | Customer Satisfaction Survey | Design Specifications | Materials Description | MCM Technology Comparison | MCM Technology Comparison... | Microstrip | More information on LTTT | Skip Intro | Step Discussion | Stripline | Stripline Using Fine... | Technology Advantages
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