Besi and its product groups Datacon, Esec, Fico and Meco are supplier of die sorting, flip chip and multi chip die bonding, packaging and plating equipment for the semiconductor industry.

Products & Services

• • Die Sorter
  • Flip Chip
  • Die Bonder
  • Advanced Packaging
  • Packaging
• • Plating
  • Epoxy
  • Led
  • Wire Bonder
  • Solar

Web Result

Products & Technology Besi

Stock Ticker: 10/07/2013 at 16:35 8.18: -0.02 (-0.29%) Search CompanyCompany ProfileCompany OverviewOrganizationQuality & EnvironmentProducts & TechnologyDie AttachWire BondingPackagingPlatingAfter SalesSpares & ToolingCustomer SupportCustomer AreaInvestor RelationsPress ReleasesFinancial Reports and...Financial CalendarAnnual General MeetingShare InformationResearch CoverageCorporate ...

http://www.besi.com/products-technology/productgroup/?tx_besi_products%5Bproduct%5D=48&tx_besi_products%5Baction%5D=show&cHash=2c77f0857053d09aec249fabefa9f8bf

Sitemap Besi

http://www.besi.com/sitemap/

Price List

http://www.besi.com/after-sales/spares-tooling/price-list/

Products & Technology Besi

http://www.besi.com/products-technology/productgroup/?tx_besi_products%5Bproduct%5D=46&tx_besi_products%5Baction%5D=show&cHash=87e0bdaf8867f48b58db9c45db78da8a

Chemistry and Tooling

http://www.besi.com/products-technology/productgroup/chemistry-and-tooling/

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