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Web Result

Memory Cooling Kits

HEAT SINK SPECIFICATIONS return 6063-T5 AL MATERIAL HEAT SINK BLUE ANODIZE HIGH CONDUCTIVTY THERMAL PAD CROSS CUTTING Application for the VGA DDR memory Chip and DDR memory module HEAT SPREADER SPECIFICATIONS AL MATERIAL HEAT SPREADER BLUE ANODIZED HIGH CONDUCTIVTY THERMAL PAD SPRING CLIP EASY TO INSTALLED PATENT PENDING ...

http://www.bluediamondgroup.com/itwinkle/other/Memory.htm

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http://www.bluediamondgroup.com/itwinkle/other/rcp.htm

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