ceramics process systems home page is the world's leading developer and manufacturer of aluminum silicon carbide (alsic) thermal managment materials, electronic packaging and power substrates such as microprocessor lids, igbt base plates, thermal substrates and microwave electronic packaging.

Products & Services

• • Electronics Cooling
  • Thermal Management
  • Cooling Magazine
  • Microwave Journal
  • Advanced Microelectronics
  • Precision Aluminum Casting
  • Aluminum Casting
  • Amc Composites
  • Nextel Fiber Composites
  • Nextel
  • Thermal Engineering
  • Electronics Thermal Management
  • Thermal Managment Materials
  • Thermal Managment Materials
  • Thermal Managment Materials
  • Metal Matrix Composite
  • Alsic
  • Aluminum Silicon Carbide
  • Thermal Management
  • Thermal Solutions
  • Electronics Cooling
  • Heat Sinks
  • Microprocessor Lids
  • Microprocessor Thermal Management
  • Flip Chips
  • Flipchips
  • Lids
  • Igbt
  • Igbt Thermal Management
  • Igbt Base Plate
  • Igbt Baseplates
  • Baseplates
  • Matched Cte
• • Cte
  • Thermal Conductivity
  • Light Weight Alsic
  • Aluminum Silicon Carbide
  • Al/sic
  • Ceramics Process Systems
  • Lanxide
  • Pcc
  • Polese
  • Ametek
  • Ixion
  • Lec
  • Electrovac
  • Raytheon
  • Motorola
  • Intel
  • Amd
  • Texas Instruments
  • Lockheed
  • Ibm
  • Asic
  • Cumo
  • Copper Molybdenum
  • Cuw
  • Copper Tungsten
  • Kovar
  • Silvar
  • Electronic Packages
  • Power Substrates
  • Heat Sink
  • Heatsink
  • Electronics
  • Electronics Cooling

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