Manufacturer of Flip Chip bonders, Die bonders, BGA / QFN / SMT rework stations, soldering equipment, smt rework machines

Products & Services

• • Die Bonder
  • Flip Chip Bonder
  • Bonding
  • Soldering
• • Rework
  • Bga Rework Machines
  • Stations
  • Bonders

Web Result

Photonics & Optoelectronics Bonding/Assembly

Print Photonics & Optoelectronics Bonding/AssemblyLaser diodes, VCSELs, photo diodes, LEDs, laser bars, sensors, detectorsWhen bonding and packaging photonic and optoelectronic devices high accuracy, superior optics, and process flexibility equate to performance. These elements combine to deliver sub-micron alignment accuracies, thus resulting in devices with greater efficiency, power cons...

http://www.finetechusa.com/bonders/applications/photonics-optoelectronics-bondingassembly/print.html

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