I C INTERCONNECT LLC
719-533-1030x102
1025 Elkton Dr
Colorado Springs, Colorado,
USA
80907-3539
Electroless nickle UBM combined with stencil printed solder offers the lowest cost flip chip wafer bumping
solution available on the market. Wafer level CSP, wire bond pad resurfacing and related wafer bumping services.
- Year Established:
- 1997
Website Links:
None | - A Compatibility Evaluation... | - A Low Cost Wafer Bumping... | - A Parametric Study... | - An Evaluation of Wafer... | - An Investigation Into... | - Breakthrough Developments... | - Commercialization of... | - Electroless Nickel/Gold... | - Evaluation of FlipFET... | - Flip Chip Reliability... | - Low Cost Wafer Bumping... | Backend Services | Design Guide | IC Interconnect Achieves... | IC Interconnect Announces... | IC Interconnect Offers... | Lead-free | Library | Map to ICI
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