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i2a Technologies Bay Area Manufacturing contact information

Home About Us Key Facts Product Development History Industry Links Wafer Bumping Features Package Reliability IC Packaging & Assembly Package Families QFP Family (TQFP, LQFP, MQFP) BGA Designs (PBGA & TFBGA) FBGA Family QFN Family (DFN) Flip Chip Stacked Die System-in-Package Wafer-Level CSP Multi Chip Module Ball Grid Array Open Cavity Plastic Packages System Products (PCB Assembly) Engin...

http://www.ipac.com/company-info.html

Open Cavity Plastic Packages

http://www.ipac.com/open-cavity.html

Turn Key Bumping, Wafer Bumping, Chip Scale Packaging, Wafer...

http://www.ipac.com/wafer-features.html

i2a Technologies Downloads

http://www.ipac.com/downloads.html

FBGA Family

http://www.ipac.com/fbga-family.html

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