Global Manufacturer Pages

International Sensor Systems, Inc.

(402) 694-6111

103 Grant St.
Aurora, Nebraska, USA   68818

http://www.internationalsensor.com

issi provides custom electronic design and manufacturing for a variety of industries, the u.s. military, and oems. international sensor systems offers five technologies - multichip module, thick film hybrid, chip-on-board, surface mount, and through-hole.
Year Established:
1973

Products & Services

    • Custom
    • Custom Package
    • Custom Manufacturing
    • Custom Electronic
    • Electronic
    • Custom Electronic Design
    • Circuit Design
    • Circuit
    • Circuit Assembly
    • Assembly
    • Chip-on-board
    • Chip On Board
    • Cob
    • Hybrid
    • Thick Film
    • Thick Film Hybrid
    • Ic
    • Laser Trim
    • Mcm
    • Multichip Module
    • Multichip
    • Pcb
    • Printed Circuit Board
    • Qfp
    • Semiconductor
    • Smt
    • Surface Mount
    • Through-hole
    • Through Hole
    • Abrasive Trim
    • Alumina
    • Aluminum Nitride
    • Association Connecting Electronics Industries
    • Ansi
    • Automatic Placement
    • Ball Bonding
    • Beryllia
    • Burn-in
    • Cad
    • Capacitor
    • Ceramic
    • Cermet
    • Chip
    • Co-fired
    • Computer Aided Design
    • Conductors
    • Conductive
    • Conformal Coat
    • Contract Manufacturing
    • Design
    • Die
    • Die Bond
    • Dielectrics
    • Dip
    • Dual-in-line-package
    • Dual In-line Package
    • Dual Inline Package
    • Electrical Test
    • Electronic
    • Engineering
    • Environmental Test
    • Eutectic
    • Film
    • Fine Pitch
    • Firing
    • Flex Circuit
    • Flip Chip
    • Gold
    • Handsolder
    • High Density Interconnect
    • Interconnect
    • Input
    • Inspect
    • Integrated Circuit
    • Ipc
    • Kevlar
    • Laminate
    • Layout
    • Metalization
    • Military Standards
    • Mil-std
    • Miniaturization
    • Module
    • Multichip
    • Multilayer
    • Multi-layer
    • Network
    • Output
    • Palladium Silver
    • Pick And Place
    • Pitch
    • Plastic Leaded Chip Carrier
    • Plcc
    • Plated Through-hole
    • Platinum Gold
    • Platinum Silver
    • Polymide
    • Polymers
    • Print
    • Printed Through Hole
    • Printed Wire Board
    • Process Control
    • Proto-type
    • Prototype
    • Pth
    • Pwb
    • Quad Flat Pack
    • Quality Assurance
    • Qa
    • Qc
    • Quality Control
    • Reflow
    • Resistor
    • Screen
    • Services
    • Silver
    • Single-inline-package
    • Single In-line Package
    • Single-in-line-package
    • Sip
    • Small Outline Integrated Circuit
    • Small Outline Package
    • Soic
    • Solder
    • Sot
    • Substrate
    • Technology
    • High-tech
    • High Tech
    • Tcr
    • Temperature Coefficient Resistance
    • Test
    • Thick
    • Thick Film Inks
    • Thick Film Pastes
    • Thin Small Outline Package
    • Thin Small-outline Package
    • Tsop
    • Trimming
    • Tsot
    • Turnkey
    • Wave
    • Wave Solder
    • Wave-solder
    • Wedge Bonding
    • Wire Bonding

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Website Snapshot of INTERNATIONAL SENSOR SYSTEMS, INC.
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