Pactech Engineering, Inc.
(513) 792-1090
1207 Neeb Rd.
Cincinnati, Ohio,
USA
45233
The official website of Pac Tech - Packaging Technologies: Advanced Packaging Equipment Manufacturing and Wafer Level Bumping
Products & Services
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- Wlcsp
- Wafer Bumping
- Wafer Level
- Backend
- Semiconductor
- Packaging
- Equipment
- Solder
- Pac Tech
- Ubm
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- Solder Jetting
- Ball Drop
- Rework
- Enig
- Enepig
- Opm
- Solder Balling
- Microelectronics
- Flip Chip
Web Result
- Laser Assisted Solder...
- HOMEWLP SERVICESGeneral OverviewEless NiAu/NiPdAu PlatingSolder BumpingBGA Rework & ReballingFlip Chip Test WaferTest Chip 2.0Test Chip 2.3Test Chip 2.5Test Chip 2.6Turnkey Services in AsiaBackside MetallizationBackend & AssemblyChemistries & MaterialsEQUIPMENTGeneral OverviewSolder Jetting & ReworkWafer Level BallingWafer Level ReworkElectroless Nickel PlatingPACLINE e-Ni Plating ...
- HS3 2D Inspection
- SEMICON West 2013
- Pac Tech - Packaging Technologies - Home
- Pac Tech - Packaging Technologies - About Us
Website Links:
None | (PlasPac) | B rokaufmann/-frau | Backend & Assembly | Backend Assembly | Backside Metallization | Chemielaborant/-in | Chemistries & Materials | Company Brochures | Contact Form | Eless NiAu/NiPdAu Plating | e-Ni/Au Plating | Equipment Services | Fachinformatiker/-in | Fachkraft Gastgewerbe | General Informations | General Overview | Germany | Global Sales | HS3 2D Inspection
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