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• • Semiconductors And Related Devices

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PAT provides low-volume flip chip assembly services for fine-pitch (100m) pixel imaging devices and temp-sensitive II-VI and III-V devices, including: optical, radiation, bio-medical sensors, and optical/polymer-MEMS. High-density interconnects are made using low applied forces onto low-temp curing, silver-filled (non-leaded) conductive epoxies that are applied using a patented stencil printing te...

http://www.polymerassemblytech.com/

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