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REMTEC - Press Releases

Press Releases November 1 2012 Remtec Expands its Enhanced Power Transfer Via (PTV ) Technology into Demanding Electronic Packaging Applications for RF & DC Power Modules April 30 2012 Remtec Expands DBC Substrate Capabilities, Provides Fast Prototyping and Delivery of Low/Medium Volume DBC Substrates for Power Applications Worldwide April 6 2012 Remtec's New Universal Finish Assures Lower Cos...

http://www.remtec.com/press.htm

REMTEC - CAPABILITIES

Capabilities LOW COST AgENIGTM THICK FILM SUBSTRATES MULTILAYER THICK FILM SUBSTRATES LASER AND PHOTO DIODE SUBMOUNTS LEADLESS CERAMIC SMT SUBSTRATES, PACKAGES AND COMPONENTS LEADLESS HERMETIC CERAMIC SMT SUBSTRATES AND PACKAGES DIRECT BOND COPPER SUBSTRATES Top < Back to About Us Page ...

http://www.remtec.com/capabilities.htm

REMTEC - HOME - CERAMIC METALLIZATION LEADER

See us at IMS 2013, Seattle, WA on June 4-6, 2013 at Booth 2603 Remtec Expands its Enhanced Power Transfer Via (PTV ) Technology into Demanding Electronic Packaging Applications for RF & DC Power Modules. ...

http://www.remtec.com/

REMTEC - SITE MAP - NAVIGATION MADE EASY

See us from Jan 25th till the 27th, at Booth 4324 < Back to About us Page REMTEC - SITE MAP REMTEC HOME Our Presence in the WWW - Start from here and learn more about us and about what we do. About Us About REMTEC and our history. -Press Releases See our press releases to know more about us. -Site Map Navigate this site with our easy navigation tools and know more about our web presence. Techno...

http://www.remtec.com/sitemap.htm

-Features of PCTF

PCTF Technology: Features and their Benefits < < <Back to PCTF Technology Page < Back to Previous Page Features Snap Shot Benefits Thick Copper Tracks (.001" -.010") Provide high current carrying capacity (to 50 Amps) Low Conductor Resistance (0.6 to 0.07 mohm/square) Heat Spreading Effect Plated Through Holes Provide front-to-back high conductance connections Low loss RF signal and gr...

http://www.remtec.com/technology-features.htm

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