tru-si provides atmospheric downstream plasma (adp) gas etching equipment, and the handling technology to enable flexible integration of advanced silicon wafer thinning processes.

Products & Services

• • Adp
  • Wafer Thinning
  • End Effectors
• • Transfer Stations
  • Equipment And Services
  • Thru-silicon Vias

Web Result

NoTouch Wands

Technology NoTouch technology enables handling of flexible ultra-thin to rigid full thickness wafers without touching or damaging them. Silicon, GaAs, InP, and other similar material can all be handled. Wands For manual handling of flexible ultrathin wafers. End Effectors For automatic handling of flexible ultrathin wafers. Videos End EffectorsPod Configuration End EffectorsCassette Configuration ...

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End EffectorsCassette...

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Tru-Si's No-Touch Technology - Tru-Si

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About Tru-Si Technologies, Inc. - Tru-Si

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End EffectorsPod Configuration

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